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gaas integrated circuit p p p p pg137gv l-band spdt switch 1996 document no. p13057ej2v0ds00 (2nd edition) date published november 1997 n printed in japan data sheet description the p pg137gv is a l-band spdt (single pole double throw) gaas fet switch which was developed for digital mobile communication system. it housed in an very small 8-pin ssop that is smaller than usual 8-pin sop and easy to install and contributes to miniaturizing the system. features ? maximum transmission power : +35 dbm min. (@ v cont = +5 v/0 v) +34 dbm typ. (@ v cont = +3 v/0 v) ? low insertion loss : 0.55 db typ. (@ 1 ghz) 0.65 db typ. (@ 2 ghz) application ? digital cellular : gsm, pdc, pcn etc. ? phs base station, pcs etc. ordering information part number package packing form p pg137gv-e1 8 pin plastic ssop (175 mil) carrier tape width 12 mm qty 2 kp/reel. absolute maximum ratings (t a = 25 c) parameters symbol ratings unit control voltage 1, 2 v cont1, 2 e 0.6 to +6.0 note v input power (v cont = +5 v) p in +36 dbm input power (v cont = +3 v) p in +34 dbm total power dissipation p tot 0.7 w operating temperature t opt e 50 to +80 c storage temperature t stg e 65 to +150 c note ( ) stands for the case of positive control condition using the floating. condition 2.7 d | v cont1 e v cont2 | d 6.0 v caution the ic must be handled with care to prevent static discharge because its circuit composed of gaas mes fet.
2 p p p p pg137gv pin connection diagram (top view) 1 2 3 4 8 7 6 5 1. v cont2 2. out2 3. gnd 4. gnd 5. in 6. gnd 7. out1 8. v cont1 g137 spdt switch ic series products part number pin (1 db) (dbm) l ins (db) isl (db) v cont (v) package applications p pg130g +34 0.5 @ 1 g 32 @ 1 g e 5/0 pdc, is-136, phs p pg131g +30 0.6 @ 2 g 23 @ 2 g e 4/0 phs, pcs, wlan p pg132g +30 0.6 @ 2 g 22 @ 2 g +3/0 phs, pcs, wlan p pg133g +25 0.6 @ 2 g 20 @ 2 g e 3/0 diversity, vco p pg137gv +34 0.55 @ 1 g 25 @ 2 g +3/0 pdc, gsm, is-136 p pg138gv +34 +37 0.55 @ 1 g 30 @ 1 g e 3/0 e 5/0 pdc, gsm, is-136 remark as for detail information of series products, please refer to each data sheet. 8-pin ssop (175 mil)
3 p p p p pg137gv [ p p p p pg137gv] recommended operating conditions parameter symbol min. typ. max. unit control voltage (on) v cont +2.7 +3.0 +5.3 v control voltage (off) v cont e 0.2 0 +0.2 v input power (v cont = +5 v) p in +35 dbm input power (v cont = +3 v) p in +33 dbm electrical characteristics (unless otherwise specified t a = 25 q q q q c, v cont = +3 v/0 v) characteristics symbol test condition min. typ. max. unit insertion loss 1 l ins1 f = 100 m to 1 ghz 0.55 0.75 db insertion loss 2 l ins2 f = 2.0 ghz 0.65 0.90 db insertion loss 3 l ins3 f = 2.5 ghz 0.8 note 1 db isolation 1 i sl1 f = 100 m to 2 ghz 20 25 db input return loss rl in f = 100 m to 2 ghz 11 db output return loss rl out 11 db input power at 1 db compression point p in (1 db) note 2 f = 500 m to 2 ghz +32 +34 dbm input power at 0.5 db compression point p in (0.5 db) f = 500 m to 2 ghz v cont = +5 v/0 v +34 dbm switching speed t sw 30 ns control current i cont v cont = +5 v/0 v 5 p a notes 1. characteristic for reference at 2.0 to 2.5 ghz. 2. p in (1 db) is measured the input power level when the insertion loss increase more 1 db than that of linear range. all other characteristics are measured in linear range. note on correct use ? when the p pg137gv is used it is necessary to use dc blocking capacitor for no. 2 pin (out2), no. 5 pin (in) and no. 7 pin (out1). the value of dc blocking capacitors should be chosen to accommodata the frequency of operation. ? insertion loss and isolation of the in-out2 is better than that of in-out1, because no. 7 pin (out1) is placed to same side of no. 5 pin (in). ? the distance between ics gnd pins and ground pattarn of substrate should be as shorter as possible to avoid parasitic parameters.
4 p p p p pg137gv typical characteristics (t a = 25 c) (this data is including loss of the test fixture) + 2.0 + 1.0 0 C1.0 C2.0 C3.0 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = 0 v v cont2 = +3 v p in = 0 dbm in-out1 input return loss vs. frequency in-out1 output return loss vs. frequency in-out1 isolation vs. frequency in-out1 insertion loss vs. frequency f - frequency - hz l ins - insertion loss - db l ins out1 out2 in 50 w f - frequency - hz isl out1 out2 in 50 w C10 C30 C40 C50 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = +3 v v cont2 = 0 v p in = 0 dbm isl - isolation - db C20 0 rl in out1 out2 in 50 w rl out out1 out2 in 50 w + 10 0 C20 C30 C40 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = 0 v v cont2 = +3 v p in = 0 dbm f - frequency - hz rl in - input return loss - db f - frequency - hz 0 C20 C30 C40 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = 0 v v cont2 = +3 v p in = 0 dbm rl out - output return loss - db C10 + 10 C10
5 p p p p pg137gv +2.0 +1.0 0 C1.0 C2.0 C3.0 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = + 3 v v cont2 = 0 v p in = 0 dbm in-out2 insertion loss vs. frequency f - frequency - hz l ins - insertion loss - db l ins out1 out2 in isl out1 out2 in 0 C10 C20 C30 C40 C50 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = 0 v v cont2 = + 3 v p in = 0 dbm in-out2 isolation vs. frequency f - frequency - hz isl - isolation - db rl in out1 out2 in 50 w rl out out1 out2 in 50 w +10 0 C10 C20 C30 C40 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = + 3 v v cont2 = 0 v p in = 0 dbm in-out2 input return loss vs. frequency f - frequency - hz rl in - input return loss - db +10 C10 C20 C30 C40 100 m 200 m 500 m 1 g 2 g 3 g v cont1 = + 3 v v cont2 = 0 v p in = 0 dbm in-out2 output return loss vs. frequency f - frequency - hz rl out - output return loss - db 0 50 w 50 w
6 p p p p pg137gv temperature characteristics pin (1db) vs. ambient temperature ?00 ?0 ?0 ?0 ?0 0 20 40 60 80 100 34 33 32 31 30 pin - input power (1db) - dbm t a ( c) v cont1 = +3 v v cont2 = 0 v f = 2 ghz non modulated signal input (cw) insertion loss, 2fo, 3fo vs. ambient temperature t a ( c) l ins - insertion loss - db v cont1 = +3 v v cont2 = 0 v f = 2 ghz non modulated signal input (cw) 2fo 3fo l ins 1.0 0.8 0.6 0.4 ?0 ?0 ?0 2fo , 3fo harmonics (dbc) ?00 ?0 0 +50 +100
7 p p p p pg137gv [ p p p p pg137gv] test board r r c2 c1 c3 nec g132 out1 v cont1 v cont2 out2 in 0.9 mm width. 0.4 mm thickness teflon glass r = 50 w using the same board that of pg132g m test circuit c1 v cont2 = 0 v/+3 v out2 50 w 50 w 1 000 pf z o = 50 w z o = 50 w z o = 50 w c2 c3 v cont1 = +3 v/0 v 1 000 pf out1 in c1, c2, c3 = 51 pf 1 2 3 4 8 7 6 5
8 p p p p pg137gv [ p p p p pg137gv] truth table of switching by condition of control voltage v cont1 +3 v 0 v v cont2 +3 v out1 out2 in out1 out2 in 0 v out1 out2 in out1 out2 in packge dimensions 8-pin plastic shrink sop (175 mil) (unit mm) 85 14 3.0 max 0.15 0.87 ?0.2 4.94 ?0.2 3.2 ?0.1 0.15 +0.10 ?.05 0.5 ?0.2 3? +7? ?? 0.575 max 0.1 ?0.1 1.8 max 1.5 ?0.1 0.10 m 0.3 +0.10 ?.05 0.65 detail of lead end
9 p p p p pg137gv recommended soldering conditions this product should be soldered in the following recommended conditions. other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. [ p p p p pg137gv] soldering process soldering conditions recommended condition symbol infrared ray reflow package peak temperature: 235 q c hour: within 30 s. (more than 210 q c) time: 3 times, limited days: no. note ir35-00-3 vps package peak temperature: 215 q c hour: within 40 s. (more than 200 q c) time: 3 times, limited days: no. note vp15-00-3 wave soldering soldering tub temperature: less than 260 q c, hour: within 10 s. time: 1 time, limited days: no. note ws60-00-1 pin part heating pin area temperature: less than 300 q c, hour: within 10 s. limited days: no. note note it is storage days after opening a dry pack, the storage conditions are 25 q c, less than 65 %, rh. caution the combined use of soldering method is to be avoided (however, except the pin area heating method).
10 p p p p pg137gv [memo]
11 p p p p pg137gv [memo]
p p p p pg137gv caution the great care must be taken in dealing with the devices in this guide. the reason is that the material of the devices is gaas (gallium arsenide), which is designated as harmful substance according to the law concerned. keep the law concerned and so on, especially in case of removal. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. anti-radioactive design is not implemented in this product. m4 96. 5

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